Quality electronic parts info sheets

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In the past Wi-Fi technology, intercell co-channel interference (Co-Channel Interference,CCI) is another important factor affecting channel capacity. The core of CSMA/CA is to listen before you speak (listen before talk,LBT). The device monitors the wireless channel first and sends data without being occupied. In the case of multi-AP mesh networking (AP,Access Point, wireless access point), the equipment in the cell will listen to the interference signal of the cell adjacent to the same channel, causing the device to mistakenly think that the wireless channel of the cell is being occupied at this time, so stop transmitting. This kind of interference will significantly reduce the network capacity when the network is not optimized or the number of available channels is very small. As shown in the figure below, the four Wi-Fi AP are networked with three channels. However, since there are only three channels available, AP1 and AP2 have to be deployed on the same channel Channel 6, when the signal of AP2 is interference to the user equipment belonging to AP1-Overlapped Basic Service Set (OBSS, overlapping basic service units, which can be understood as overlapping cells with the same frequency).

Due to the spread of the global COVID-19 epidemic in 2020, automobile production is in the doldrums (figure 1). The number of cars produced worldwide, which was 92.18 million in 2019 before the COVID-19 epidemic, fell by 14.56 million to 77.62 million in 2020 and appears to have fallen by 1.2 million to 76.42 million in 2021. The decline in car production in 0A2020 was caused by the COVID-19 epidemic, which led to a sharp drop in demand. However, the downturn in car production in 2021 is mainly due to a shortage of semiconductors. In fact, by 2021, the shortage of semiconductors has made it impossible to build cars, and the governments of Japan, the United States and Germany, with automobile as the core industry, have made requests to TSMC to increase the production of on-board semiconductors through the government of Taiwan. The semiconductors in short supply at that time were 28nm logic semiconductors and MCU (Micro Controller Units, commonly known as “microcontrollers”).

The basic content of SoC definition is mainly in two aspects: one is its composition, and the other is its formation process. The composition of the system-level chip can be a system-level chip control logic module, a microprocessor/microcontroller CPU core module, a digital signal processor DSP module, an embedded memory module, and an interface module for external communication, and an ADC/DAC module. Analog front-end modules, power supply, and power management modules, for a wireless SoC there are also RF front-end modules, user-defined logic (which can be implemented by FPGA or ASIC), and micro-electromechanical modules, and more importantly, an SoC chip with embedded Basic software (RDOS or COS and other application software) modules or loadable user software, etc. The system-on-chip formation or generation process includes the following three aspects.

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